Process Capability
PRINT CIRCUIT BOARD ASSEMBLY
- Single / Double side PCB
- SMT, Thru-hole, and mix technology PCB
- Fine and Ultra fine Pitch down to 10mil L/S
- Board thickness from 0.010" to 36 layers
- Board dimension- max 24" x 24"
- Component : QFP, PLCC, BGA, uBGA, 0201
- PCB Rework / Modification / BGA-Reball
- Flex circuit assembly
- Real time X-RAY capable
- Press fit Backplanes
ELECTRO-MECHANICAL ASSEMBLY
- Sub-Assembly
- Final Assembly
- Functional Test / Burn-in
- Order Fulfillment
- Cable and Harness assembly


