Process Capability

  • PRINT CIRCUIT BOARD ASSEMBLY

  • Single / Double side PCB
  • SMT, Thru-hole, and mix technology PCB
  • Fine and Ultra fine Pitch down to 10mil L/S
  • Board thickness from 0.010" to 36 layers
  • Board dimension- max 24" x 24"
  • Component : QFP, PLCC, BGA, uBGA, 0201
  • PCB Rework / Modification / BGA-Reball
  • Flex circuit assembly
  • Real time X-RAY capable
  • Press fit Backplanes
  • ELECTRO-MECHANICAL ASSEMBLY

  • Sub-Assembly
  • Final Assembly
  • Functional Test / Burn-in
  • Order Fulfillment
  • Cable and Harness assembly
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